Manufacturing Assembly and Wirebonding Operator x3 Role PurposeThe Manufacturing Assembly and Wirebonding Operator will be responsible for the assembly, wire bonding, inspection, and process control of electronic or semiconductor devices to ensure products meet quality, reliability, and performance requirements in a manufacturing environment.Key ResponsibilitiesAssemblyAssemble parts and subassemblies using hand tools, fixtures, and equipmentFollow work instructions, drawings, and standard operating proceduresMeet production targets while maintaining quality standardsInspect assembled products for defects and ensure conformance to specificationsReport quality issues, equipment problems, or material shortagesMaintain a clean and organised work area (5S)Follow all safety policies and proceduresComplete required production and quality documentationSupport continuous improvement initiativesWire BondingPerform wire bonding operations (ball bond, wedge bond, or ribbon bond) using gold and palladium wireSet up and operate wire bond machines (manual or automatic)Optimise bonding parameters (force, power, time, loop height)Conduct bond pull, shear, and visual inspectionsIdentify and troubleshoot wire bond defects (NSOP, lifted bonds, heel cracks, shorts)Qualifications and ExperiencePrior Wirebonding, Manufacturing and Assembly experience is essentialAbility to read basic drawings and work instructionsExperience using hand tools and precision assembly equipmentSkills and ..... full job details .....